Fujifilm Launches Flexible SMT Solution for Advanced Manufacturing

As market demands grow increasingly complex and fast-paced, traditional SMT production lines face unprecedented challenges. The Fuji NXT III series emerges as a modular, high-flexibility solution designed to address these demands—enabling efficient, high-quality production across small batches and diverse product types.

The NXT III's core innovation lies in its modular architecture, allowing users to configure functional modules tailored to specific needs. Whether optimizing for high-volume single-product runs or rapid changeovers between multiple product variants, the system adapts seamlessly.

• Configurable Modules: Production lines can incorporate precision placement modules for delicate components or specialized units for large parts, ensuring optimal performance across applications.
• Interchangeable Components: Placement heads, feeders, and modules operate as independent units, enabling granular optimization for different component types and packaging formats.
• Future-Proof Scalability: The platform supports incremental upgrades through additional modules or unit replacements, eliminating obsolescence concerns.

Engineered for minimal downtime, the NXT III incorporates maintenance-focused innovations:

• Tool-Free Head Replacement: Lightweight placement heads enable swift changes without specialized equipment.
• Unilateral Operation: Single-side material handling reduces operator movement and fatigue.
• Offline Servicing: Modules can be swapped for maintenance without interrupting production.

The system leverages smart manufacturing technologies for quality assurance:

• Component ID Tracking: RFID-enabled management of nozzles, feeders, and heads prevents misconfigurations.
• Automated Calibration: Self-adjusting placement heads ensure consistent accuracy after changes.
• Comprehensive Data Logging: Detailed production records support analytics and traceability.

Integrated quality control features include:

• Intelligent Part Sensor (IPS): Detects tombstoning, missing components, and orientation errors.
• LCR Testing: Validates electrical properties of passive components pre-placement.
• 3D Coplanarity Checks: Measures connector pin alignment to prevent faulty interconnects.

The system achieves 67,200 components per hour per square meter—industry-leading density for microcomponents like 008004” (0201 metric) chips through:

• Adaptive vision systems
• Dynamic motion control
• Low-impact placement technology

Beyond standard placement, the platform supports:

• In-line dispensing and solder paste transfer
• Mixed-technology assembly via DX placement heads
• Pressure-sensitive applications for delicate components

New M3 IIISE and M6 IIIL modules deliver:

• 17% faster cycle times for high-density boards
• Real-time placement force control for ultra-thin components